/ Conferences_en / EMLC 2007 / Committees /  Printversion 
Committees


EMLC Organizing Committee

Conference Chair     Dr. Uwe Behringer, UBC Microelectronics, Ammerbuch, Germany

Programme Chairs  Mr. J. Waelpoel, ASML, Veldhoven, The Netherlands
                                      Dr. W. Maurer, InfineonTechnologies AG, Munich, Germany



The International Steering Committee of the European Mask and Lithography Conference, EMLC2007

The names marked with (*) are in addition members of the program Committee.
The names underlined are in addition the members of the Grenoble local committee.

Mr. F. Abboud Intel Corp., Santa Clara, CA
Mr. M. Archuletta RAVE LLC Nanomachining, Saint Petersburg, FL, USA
Dr. M. Arnz Carl Zeiss SMT AG, Oberkochen, Germany(*)
Dr. A. Barberet IBM Microelectronics, New York, USA
Dr. U. Behringer UBC Microelectronics, Ammerbuch Germany(*)
Dr. C. Blaesing-Bangert Vistec Semiconductor Systems, Wetzlar, Germany
Dr. W. Brünger FhG-ISIT, Itzehoe, Germany
Mr. P Chen Taiwan Mask Corp., Hsinchu,Taiwan(*)
Dr. C. Constantine Oerlikon USA Inc., St. Petersburg, FL, USA
Prof. R. Engelstad University of Wisconsin, Madison, WI, USA
Mr. D. Farrar HOYA Corporation, LONDON, UK
Mr. M. Fischer KLA Tencor GmbH, Puchheim, Germany
Mr. O. Fortagne Vistec Semiconductor Systems GmbH, Jena, Germany
Mr. C. Gale Applied Materials, Dresden,Germany(*)
Mr. B. Grenon Grenon Consulting, Inc., Colchester,VT, USA(*)
Mr. H. Hartmann s3solution, Munich, Germany
Mr. N. Hayashi Dai Nippon Printing Co. Ltd., Saitama, Japan
Dr. A.C. Hourd Compugraphics International Ltd., Glenrothes, Scotland, UK(*)
Mr. R. Jonckheere IMEC, Leuven, Belgium(*)
Dr. C.K.. Kalus SIGMA-C AG, Munich, Germany(*)
Mr. K.R. Kimmel IBM Albany Nanotech Facility, Albany, USA
Prof. A. Kostka Technical University of Darmstadt, Germany
Mr. H. Lehon KLA-Tencor Corporation, San Jose, CA, USA
Dr. H. Loeschner IMS Nanofabrication AG, Vienna, Austria *
Dr. W. Maurer Infineon, Munich, Germany(*)
Mr. B. Naber Cadence Design Systems Inc., San Jose, USA(*)
Mr. E. Rausa Oerlikon USA Inc., Saint Petersburg, FL, USA
Dr. C. Reita CEA-LETI, Grenoble, France(*)
Dr. F. Reuther micro resist technology GmbH, Berlin, Germany
Dr. C. Romeo ST-Microelectronics, Agrate Brianza, Italy(*)
Mr. K. Ronse IMEC, Leuven, Belgium
Prof. H. Scheer University of Wuppertal Wuppertal, Germany(*)
Mr. Gerd Scheuring Mue Tec GmbH, Munich, Germany
Dr. R. Schnabel VDE/VDI-GMM Frankfurt, Germany(*)
Mr. M. Staples AMD Saxony LLC & Co. KG, Dresden, Germany
Mrs. I. Stolberg Vistec Semiconductor Systems GmbH, Jena, Germany(*)
Dr. R. Takke Heraeus Quarzglas GmbH & Co.KG, Kleinostheim, Germany
Mr. K. Tasaki KLA-Tencor Japan Ltd., Yokohama City, Japan
Dr. S. Tedesco CEA-LETI, Grenoble, France(*)
Mr. M. Tissier Toppan Photomasks S.A., Rousset Cedex, France(*)
Mr. G: Unger Infineon Technologies AG, Munich, Germany(*)
Mr. J. Waelpoel ASML, Veldhoven, NL(*)
Mr. J.T. Weed SYNOPSYS, Inc., Mountain View, CA, USA
Mr. J. Whittey Vistec Semiconductor Systems, Oakdale, CA, USA(*)
Mr. J. Wiley Brion Technologies, Santa Clara, CA, USA
Mr. H Wolf Photronics MZD GmbH, Dresden, Germany(*)
Mr. N. Yoshioka Renesas Technology Corp., Tokyo, Japan
Mr. L. Zurbrick KLA-Tencor Corporation, San Jose, CA, USA(*)

 
  
 























2006 GMM