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Committees


Members of the International Steering Committee of the EMLC
and
Members of the International Technical Program Committee of the EMLC 2008 (*)


Conference Chair     Dr. Uwe Behringer (*), UBC Microelectronics, Ammerbuch, Germany

Program Chairs        Dr. W. Maurer (*), InfineonTechnologies AG, Munich, Germany
                                      Mr. J. Waelpoel (*), ASML, Veldhoven, The Netherlands



Mr. F. Abboud Intel Corp., Santa Clara, CA, USA
Dr. M. Arnz Carl Zeiss SMT AG, Oberkochen, Germany (*)
Mr. E. Baracchi ST Microelectronics, Agrate Brianza, Italy
Dr. C. Blaesing Carl Zeiss SMS GMbH, Jena, Germany
Mr. P Chen Taiwan Mask Corp., Hsinchu, Taiwan (*)
Dr. C. Constantine Oerlikon USA Inc., St. Petersburg, FL, USA (*)
Prof. R. Engelstad University of Wisconsin, Madison, WI, USA
Mr. B.G. Eynon Sematech-Samsung Assignee, Albany, USA (*)
Mr. D. Farrar HOYA Corporation, LONDON, UK
Mr. M. Fischer KLA Tencor GmbH, Puchheim, Germany
Mr. O. Fortagne Vistec Semiconductor Systems GmbH, Jena, Germany
Mr. C. Gale Applied Materials, Dresden, Germany(*)
Mr. B. Grenon Grenon Consulting, Inc., Colchester, VT, USA (*)
Mr. H. Hartmann s3solution, Munich, Germany
Mr. N. Hayashi Dai Nippon Printing Co. Ltd., Saitama, Japan (*)
Dr. A.C. Hourd Compugraphics International Ltd., Glenrothes, Scotland, UK (*)
Mr. R. Jonckheere IMEC, Leuven, Belgium (*)
Dr. C.K. Kalus Synopsys GmbH, Aschheim, Germany (*)
Mr. K.R. Kimmel AMTC, Dresden, Germany (*)
Ms. B. Lauche Photronics MZD GMbH, Dresden, Germany
Mr. H. Lehon KLA-Tencor Corporation, San Jose, CA, USA
Dr. H. Loeschner IMS Nanofabrication AG, Vienna, Austria (*)
Mr. B. Naber Cadence Design Systems Inc., San Jose, USA (*)
Mr. J. Perrocheau JEMI-France, Rousset, France
Dr. Ch. Pierrat Cadence Design Systems Inc., San Jose, USA (*)
Mr. E. Rausa Oerlikon USA Inc., Saint Petersburg, FL, USA (*)
Dr. C. Reita CEA-LETI, Grenoble, France
Mr. D. J. Resnick Molecular Imprints, Austin, TX, USA (*)
Dr. F. Reuther micro resist technology GmbH, Berlin, Germany
Dr. C. Romeo ST-Microelectronics, Agrate Brianza, Italy (*)
Mr. K. Ronse IMEC, Leuven, Belgium
Prof. H. Scheer University of Wuppertal, Germany (*)
Mr. Gerd Scheuring Mue Tec GmbH, Munich, Germany
Dr. R. Schnabel VDE/VDI-GMM, Frankfurt, Germany (*)
Mr. M. Staples AMD Saxony LLC & Co. KG, Dresden, Germany
Mrs. I. Stolberg Vistec Semiconductor Systems GmbH, Jena, Germany (*)
Dr. S. Tedesco CEA-LETI, Grenoble, France (*)
Mr. M. Tissier Toppan Photomasks S.A., Rousset, France (*)
Mr. G. Unger Qimonda Dresden GmbH & Co. OHG, Dresden, Germany (*)
Mr. J.T. Weed SYNOPSYS, Inc., Mountain View, CA, USA
Mr. J. Whittey Vistec Semiconductor Systems, Oakdale, USA (*)
Mr. J. Wiley Brion Technologies, Santa Clara, CA, USA
Mr. H. Wolf Photronics MZD GmbH, Dresden, Germany (*)
Mr. N. Yoshioka Renesas Technology Corp., Tokyo, Japan
Mr. L. Zurbrick KLA-Tencor Corporation, San Jose, CA, USA (*)

 
  
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