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The EMLC2009 Steering(*) and Program Committee of the 25th European Mask and Lithography Conference, EMLC 2009

Conference Chair         Dr. Uwe Behringer (*), UBC Microelectronics, Ammerbuch, Germany

Co-Conference Chair   Mr. B. Grenon, Brian Consulting, Colchester, VT, USA
                                          Naoya Hayashi (*), DNP, Saitama, Japan

Program Chairs            Dr. W. Maurer (*), InfineonTechnologies AG, Munich, Germany
                                          Mr. J. Waelpoel (*), ASML, Veldhoven, The Netherlands

Co-Program Chair        
Mr. W. Montgomery, CNSE assignee at SEMATECH, Albany, NY, USA

Dr. M. Arnz Carl Zeiss SMT AG, Oberkochen, Germany
Mr. P Chen Taiwan Mask Corp., Hsinchu, Taiwan
Mr. B. Eynon Samsung assignee at SEMATECH, Albany, NY, USA
Mr. C. Gale Applied Materials, Dresden, Germany
Dr. A. C. Hourd Compugraphics International Ltd., Glenrothes, Scotland
Mr. R. Jonckheere IMEC, Leuven, Belgium
Dr. C. K. Kalus Synopsys GmbH, Aschheim, Germany
Mr. H. Lehon KLA-Tencor Corporation, San Jose, CA, USA
Dr. H. Loeschner IMS Nanofabrication AG, Vienna, Austria
Mr. B. Naber Cadence Design Systems Inc., San Jose, USA
Mr. P. Nikolsky ASML, Veldhoven, The Netherlands
Dr. Ch. Pierrat Cadence Design Systems Inc., San Jose, USA
Mr. T. Pratt KLA-Tencor Corporation, USA
Dr. C. Reita CEA-LETI, Grenoble, France
Dr. C. Romeo ST-Microelectronics, Agrate Brianza, Italy
Prof. Dr. H.-C. Scheer University of Wuppertal, Germany
Dr. R. Schnabel (*) VDE/ VDI- GMM, Frankfurt, Germany
Mrs. I. A. Stolberg Vistec Semiconductor Systems GmbH, Jena, Germany
Dr. S. Tedesco CEA-LETI, Grenoble, France
Mr. M. Tissier Toppan Photomasks S.A., Rousset, France
Mr. G. Unger Qimonda Dresden GmbH, Dresden, Germany
Mr. J. Whittey Vistec Semiconductor Systems, Oakdale, USA
Mr. H. Wolf Photronics MZD GmbH, Dresden, Germany
Mr. L. Zurbrick Agilent Technologies Inc., San Jose, CA, USA


2007 GMM