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Conference Topics

Deadline for Papers:
  June 8, 2007


Those interested in actively participating the conference and making oral/poster presentations are requested to submit a one page abstract in English to conference-papers@vde.com by June 8, 2007. The abstract should be a brief synopsis of your paper. It should provide a quick outline of your presentation to judge the quality of your work. Please indicate the preference of oral or poster presentation. The authors of accepted contributions will be notified by June 29, 2007.

Subjects of Interest

  • Copper/low-k CMP processes and control
  • CMP process integration issues and reliability
  • CMP defects
  • CMP consumables (pads, slurries)
  • CMP modelling, simulation and theory
  • Metrology, characterization and test
  • Advances in ECD/ECP/ECMP processes and tools
  • CMP in emerging technologies
  • Dielectric/STi CMP processes and control
  • Corrosion control during CMP process
  • Post CMP cleaning
  • CMP equipment and metrology
  • Chemical and physical mechanisms of CMP
  • Advanced CMP process control techniques
  • Low-shear CMP

2007 GMM