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Committees

 

 

Technical Programme Co-Chairs

Bernhard Walke (speaker), RWTH Aachen Unversity
Klaus David, University of Kassel
Martin Haardt, Ilmenau University of Technology
Petri Mähönen, RWTH Aachen University

Vice-Chairs and Area Coordinators

Europe: Hamid Aghvami, King's College London, UK
Americas: Kaveh Pahlavan, Worcester Polytechnic Institute, USA
Asia Pacific: Shuzo Kato, Ommi Wireless, USA

Local Arrangements

Walter Konhäuser, Siemens, Germany

Institutional Sponsors

IEEE COMSOC, VDE ITG

Tutorial Chairs

Gerhard Fettweis, University of Dresden, Germany
Carmelita Goerg, University of Bremen, Germany
Martin Haardt, Ilmenau University of Technology, Germany

Invited Papers Chair

Rajamani Ganesh, QUALCOMM, India
Sastri Kota, Harris Corporation, USA

TPC Members

Andy Aftelak, Motorola LTD,
Hamid Aghvami, King's College London, UK
Ramon Agusti, Universitat Politecnica de Catalunya (UPC), Spain
Ozgur Akan, Middle East technical University, Turkey
Angeliki Alexiou, Bell Labs, Lucent Technologies,
Nancy Alonistioti, University of Athens, Greece
Emad Alsusa, University of Manchester, UK
Carles Anton-Haro, Telecommunications Technological Center of Catalonia (CTTC), Spain
Stefan Arbanowski, Fraunhofer FOKUS, Germany
Gerd Ascheid, RWTH Aachen University, Germany
Chandra Athaudage, University of Melbourne, Australia
Saewoong Bahk, Seoul National University, Korea
Victor Bahl, Microsoft Research, USA
Matthew Baker, Philips, UK
Hendrik Berndt, DoCoMo Eurolabs, Germany
Qi Bi, Lucent, USA
Chris Blondia, University of Antwerp, Belgium
Helmut Boelcskei, ETH Zürich, Switzerland
Didier Bourse, Motorola, France
Götz-Philip Brasche, European Microsoft Innovation Center, Germany
Andrew T. Campbell, Columbia University, USA
Claudio Cassetti, Politechnico di Torino, Italy
Kwang-Cheng Chen, National Taiwan University, Taiwan
Chong Chia-Chin, Samsung Advanced Institute of Technology, Korea
Song Ci, University of Michigan - Flint, USA
Luis Correia, Technical University of Lisbon, Portugal
Laurie Cuthbert, Queen Mary, University of London, UK
Manuel Dinis, Portugal Telecom Inovacao, Portugal
Mischa Dohler, King's College London, UK
Olaf Drögehorn, University of Kassel, Germany
Andrzej Duda, LSR-IMAG Laboratory, France
Joerg Eberspaecher, Munich University of Technology, Germany
Jean-Pierre Ebert, IHP Microelectronics, Germany
Eylem  Ekici, Ohio State University, USA
Berry Evans, University of Surrey, UK
David Everitt, University of Sydney, Australia
Yuguang Fang, University of Florida, USA
Gerhardt Fettweis, Technische Universität Dresden, Germany
Rajamani Ganesh, Qualcomm, USA
Jorge Garcia, Universidad Politecnica de Catalunya, Spain
Carmelita Görg, University of Bremen, Germany
Kurt Geihs, University of Kassel, Germany
Alex Gershman, McMaster University, Canada
Ali Ghrayeb, Concordia University, Canada
Gong Ke, Tsinghua University, China
Davide Grillo, Alcatel, Italy
Harald Haas, International University of Bremen, Germany
Zygmunt Haas, Cornell University, USA
Rene Habendorf, Dresden University of Technology, Germany
Jörg Habetha, Philips Research, Germany
Stephen Hailes, University College London, UK
Boudewijn Haverkort, University of Twente, Netherlands
Robert W. Jr.  Heath, University of Texas at Austin, USA
Johan Hjelm, Ericsson Research,
Kari Hooli, University of Oulu, Finland
Valery Ipatov, University of Turku, Finland
Babak Jafarian, Cal IT2, USA
Tommi Jämsä, Elektrobit Ltd, Finland
Uma Jha, Qualcomm Inc., USA
Kari Kalliojarvi, Nokia Research Center, Finland
Georgios Karetsos, National Technical University of Athens, Greece
Shuzo Kato, Omni Wireless, USA
Konosuke Kawashima, Tokyo Univ. of Agriculture & Technology, Japan
Arzad Kherani, INRIA, France
Jamishid Khun-Jush, Qualcomm, Germany
Nak Myeong Kim, Ewha woman university, Korea
Anja Klein, TU Darmstadt, Germany
Mika Klemettinen, Nokia,
Sastri Kota, Harris Corporation, USA
Rolf Kraemer, IHP Microelectronics,
Vinod Kumar, Alcatel R&I, France
Miguel Lagunas, Telecommunications Technological Center of Catalonia, Spain
Wookwon Lee, University of Arkansas, USA
Per Lehne, Telenor R&D, Norway
Ralf Lehnert, Dresden University of Technology, Germany
Khaled Letaief, EEE Department of HKUST, China
Yonghui Li, University of Sydney, Australia
Christoph Lindemann, University of Dortmund, Germany
Jürgen Lindner, University of Ulm, Germany
Matthias Lott, Siemens AG, Germany
Angel Lozano, Bell Labs (Lucent Technologies), USA
Stefan Mangold, Swisscom Innovations, Switzerland
Cecilia Mascolo, University College London, UK
Rudolf Mathar, RWTH Aachen University, Germany
Michela Meo, Politechnico di Torino, Italy
Michael Meyer, Ericsson Research, Ericsson Eurolab Deutschland GmbH, Germany
Daniele Miorandi, University of Padova, France
Nikolas Mitrou, National Technical University of Athens, Greece
Andreas Mitschele-Thiel, TU Ilmenau, Germany
Makoto Miyake, Mitsubishi Electric, Japan
Werner Mohr, Siemens, Germany
Luis Munoz, University of Cantabria, Spain
Siamäk Naghian, Nokia, Finland
Hajime Nakamura, KDDI R&D Laboratories, Japan
Asoke Nandi, University of Liverpool, UK
Norbert Niebert, Ericsson GmbH, Germany
Zhisheng Niu, Tsinghua University, China
Björn Ottersten, KTH Stockholm, Sweden
Dimitris Pados, State University of New York at Buffalo, USA
Kaveh Pahlavan, Worchester Polytechnic Institute, USA
Ashish Pandharipande, Samsung,
Xavier Perez-Costa, NEC Network Laboratories, NEC Europe Ltd., Germany
Stephan Pfletschinger, Centre Technologic de Telecommunicacions de Catalunya, Spain
George Polyzos, Athens University of Economics and Business, Greece
Borislav Popovski, University Ss "Cyril and Methodius", Macedonia
Bin Qiu, Monash University, Australia
Kimmo Raatikainen, University of Helsinki, Dpt. Of Computer Science, Finland
Moshe Ran, MostlyTek Ltd, Israel
Dipankar Raychaudhuri, Rutgers University, USA
Hermann Rohling, Technical University of Hamburg-Harburg, Germany
Angelos Rouskas, University of the Aegean, Greece
Oriol Sallent, Universidad Politecnica de Catalunya, Spain
Rainer Sauerwein, Siemens Corporate Technology, Germany
Mamoru Sawahasi, NTT DoCoMo, Japan
Andreas Schieder, Ericsson, Germany
Asrar Sheikh, King Fahd University of Petrol and Minerals, Saudi Arabia
Harsha Sirisena, University of Canterbury, New Zealand
Elvino Sousa, University of Toronto, Canada
Umberto Spagnioli, Politecnico di Milano, Italy
Joachim Speidel, University of Stuttgart, Germany
Gordon Stuber, Georgia Institute of Technology, USA
Peter Stuckmann, European Commission, Belgium
Hideaki Takagi, University of Tsukuba, Japan
Yutaka Takahashi, Kyoto University, Japan
Chai Keong Toh, University of London, Queen Mary, UK
Phuoc Tran-Gia, University of Wuerzburg, Germany
Murat Uysal, University of Waterloo, Canada
Andras Valko, Ericsson Research, Sweden
Vasos Vassiliou, University of Cyprus, Cyprus
Iakovos Venieris, National Technical Univ. of Athens, Greece
Ivan Vukovic, Motorola, USA
Wenye Wang, North Carolina State University, USA
Werner Wiesbeck, University of Karlsruhe, Germany
Christian Wietfeld, University of Dortmund, Germany
Yang Xiao, University of Memphis, USA
Linda Xie, University of North Carolina at Charlotte, USA
Bangnan Xu, T-Systems, Germany
Yasushi Yamao, NTT DoCoMo Inc., Japan
Susumu Yoshida, Kyoto University, Japan
Hotoshi Yoshino, NTT DoCoMo, Japan
Xiao-Hu You, Southeast University, China
Chan-Hyun Youn, Information and Communication University, Korea
Mustafa Youssef, University of Maryland, USA
Jans Zander, Royal Inst Tech, Stockholm, Sweden
Djamal Zeghlache, Institut National de Telecommunications, France
Hans-Juergen Zepernick, Blekinge Institute of Technology, Sweden
Wolfgang Zirwas, Siemens, Germany
Michele Zorzi, University of Padova, Italy